Heterogeneous Photonic Packaging - John Osenbach - IPC 2018

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  • #IEEE
  • #IPC
  • #2018
  • #photonics
  • #conference
  • #industry
  • #business
  • #Industry Day
  • #sessions
  • #packaging
  • #design
  • #manufacturing
  • #profitability
  • #electrical requirements
  • #thermal requirements
  • #products
  • #devices
  • #new materials
  • #technology

John Osenbach, Infinera Corporation, discusses photonics packaging from an industry perspective, especially geared toward manufacturing and making profits. Osenbach gives an overview of drivers, InP- or Si-Photonics, photonics packaging needs, and solutions, as well as future trends.

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  • Published on
  • August 7, 2019

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