2020 & 2021 IEEE Electronics Packaging Technology Award- Mitsumasa Koyanagi, Peter Ramm & Chin C. Lee

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The 2020 IEEE ELECTRONICS PACKAGING TECHNOLOGY AWARD recognizes meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies, sponsored by the IEEE Electronics Packaging Society, is presented to Co-Recipients MITSUMASA KOYANAGI (LFIEEE)—Senior Research Fellow, Tohoku University, and PETER RAMM (SMIEEE)— Head of Strategic Projects, Fraunhofer EMFT, for pioneering contributions leading to the commercialization of 3D wafer and die level stacking packaging.

The 2021 IEEE ELECTRONICS PACKAGING TECHNOLOGY AWARD recognizes meritorious contributions to the advancement of components, electronic packaging, or manufacturing technologies, sponsored by the IEEE Electronics Packaging Society, is presented to CHIN C. LEE (LFIEEE)—Retired Professor, University of California, for contributions to new silver alloys, new bonding methods, flip-chip interconnect, and education for electronics packaging.

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