28nm CMOS Wireless Connectivity Combo IC - Chia-Hsin Wu - RFIC Showcase 2018

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#RFIC #2018 #IMS #Philadelphia #MTTS #showcase #electrical engineering #design #wireless #communications #integration #massive MIMO #wifi #connectivity

Samsung’s Chia-Hsin Wu introduces his paper focusing on short-range wireless connectivity in mobile devices. Wu delves into the integration requirements for the 28nm CMOS Wireless Connectivity Combo IC with a reconfigurable 2x2 MIMO WiFi supporting 80+80MHz 256-QAM and BT 5.0 [RTU2B-1].

Samsung’s Chia-Hsin Wu introduces his paper focusing on short-range wireless connectivity in mobile devices. Wu delves into the integration requirements for the 28nm CMOS Wireless Connectivity Combo IC with a reconfigurable 2x2 MIMO WiFi supporting 80+80MHz 256-QAM and BT 5.0 [RTU2B-1].

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