Electrically-Pumped 1.31 μm MQW Lasers by Direct Epitaxy on Wafer-Bonded InP-on-SOI Substrate - Yingtao Hu - Closing Ceremony, IPC 2018

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    IEEE.tv is made possible by the Members of IEEE.

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    In addition to exclusive access to IEEE.tv programming, IEEE members have file download, and can save favorite videos with myTV.

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Yingtao Hu, Hewlett Packard Labs, speaks on behalf of his colleague’s collaborative work with MQW Lasers and the motivation of transitioning to memory-driven computing. Hu goes into detail on the bonding process and offers a comparative cost analysis.

  • Published on
  • December 13, 2018

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