IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates

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  • #2012
  • #IMS
  • #MicroApps
  • #Reducing Active Device Temperature Rise
  • #RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminate
  • #Allen F. Horn

IMS 2012 MicroApps presents " Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminate," by Allen F. Horn, III of Rogers.

  • Published on
  • July 6, 2012

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