Micro-Apps 2013: Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software

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Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software

Dr. John Dunn, AWR Corporation

3D electromagnetic simulators are commonly used to help design board-to-chip transitions. AWR has made this process easier with the introduction of Analyst™, a new 3D FEM simulator integrated within its circuit design environment. This presentation highlights how the new features in Analyst can be used to optimize a chip-module-board transition. The transition discussed is typical of a high-speed analog signal line, going from a high performance system board, onto a BGA mounted module, through the module, and onto an RFIC chip by means of bond wires. The presentation demonstrates how Analyst's unique ability to simulate only the desired portions of the layout can be leveraged to improve this process using three steps: identifying and isolating the problem areas, identifying their electrical behavior, and modifying the layout to bring the behavior into spec. Using this process, it was possible to isolate the various sections of the tranistion without having to cut and piece the layout. In addition, drawing was kept to a minimum because of the tight integration of Analyst with the rest of the Microwave Office® designs environment. Finally, because Analyst is tightly integrated into Microwave Office, the results could be quickly used as needed in schematics and optimization and tuning studies.

IMS2013 Micro-Apps Thursday 1210

Optimizing Chip, Module, Board Transitions Using Integrated EM and Circuit Design Simulation Software

Dr. John Dunn, AWR Corporation

IMS2013 Micro-Apps Thursday 1210

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