Challenges and Recent Perspectives of 3D Heterogeneous Integration

110 views
Download
  • Share
Create Account or Sign In to post comments
#reliability #photonics #electronics #advanced packaging #heterogeneous integration

(13:51) - Zhenfeng Li, Harbin Institute of Technology

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(13:51) - Zhenfeng Li, Harbin Institute of Technology

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

Advertisment

Advertisment