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Emerging Challenges on Thermal Modeling and Simulation for Advanced 3DIC Systems

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration #EDA

(36:00 + Q&A) - Norman Chang, Ansys

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(36:00 + Q&A) - Norman Chang, Ansys

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

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