Correlation Between Delamination and Solder Joint Fatigue of QFN Package

0 views
Download
  • Share
Create Account or Sign In to post comments
#delamination #solder joint fatigue #QFN package

(22:05 + Q&A) Daniel Riegel, Bosch

Delamination between surfaces in the package can impact the lifetime of solder joints, as established by destructive failure mode analysis like cross-sections or dye-and-pry. Non-destructive failure mode analysis with scanning acoustic microscope (SAM) allows detection of delamination but not cracks in the solder joints. We use on-chip stress sensors to detect delamination in-situ and formulate the goal to link this information to the remaining useful life of solder joints.

Please visit our REPP Symposium website and sign up for our IEEE ListServ Dlist: https://attend.ieee.org/repp/

(22:05 + Q&A) Daniel Riegel, Bosch

Delamination between surfaces in the package can impact the lifetime of solder joints, as established by destructive failure mode analysis like cross-sections or dye-and-pry. Non-destructive failure mode analysis with scanning acoustic microscope (SAM) allows detection....

Speakers in this video

Advertisment

Advertisment