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FE-Modeling Validation of Innolot Deformation Behavior with TMF Testing under Cyclic Shear-Dominant Thermomechanical Loading

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration

(21:06) - Jonas Gleichauf, Bosch

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(21:06) - Jonas Gleichauf, Bosch

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

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