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Grain Orientation, Microstructure Evolution and Fatigue Life Prediction of Solder Joints under Thermal Shock Test for Fan-out Wafer Level Packaging

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#reliability #photonics #electronics #advanced packaging #heterogeneous integration

(13:40) - Xinyi Jing, Harbin Institute of Technology

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(13:40) - Xinyi Jing, Harbin Institute of Technology

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

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