Nonlocal Damage Modeling of Solder Joint Failure under Thermal and Thermomechanical cyclic Loading
(20:40 + Q&A) - Maniar Youssef, Bosch
For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist: attend.ieee.org/repp
(20:40 + Q&A) - Maniar Youssef, Bosch
For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist: attend.ieee.org/repp