1. Home
  2. Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration

Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration

33 views
Download

Download

IEEE.tv is made possible by the Members of IEEE.

This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to enable this feature.

In addition to exclusive access to IEEE.tv programming, IEEE members have file download, and can save favorite videos with myTV.

Discover all the benefits of IEEE membership!

Belong to the world's largest technical proffecional society

  • Share
IEEE Electronics Packaging Society
Create Account or Sign In to post comments
#reliability #photonics #electronics #advanced packaging #heterogeneous integration

(20:35 + Q&A) - Yujui Lin, Stanford University

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(20:35 + Q&A) - Yujui Lin, Stanford University

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

Advertisment

Next Up

00:38:22
Semiconductor Supply Chain “Eco System” Overview
>
00:53:51
Increasing Role of Silicon Photonics and Criticality of Advanced Packaging Technologies to Meet Future Compute Demands
>
00:15:57
Simulations of Reliability Issues in Microelectronic Packages
>
00:16:37
LED Reliability Factors on IMS PCBs
>
00:29:45
Monitoring the Reliability of Two-Phase Flows using Machine Learning Strategies
>
00:18:59
Reliability Problems of Optoactive Materials in LED Packaging
>

Advertisment