1. Home
  2. Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration

Warpage Characterization of the Direct Bonded Copper (DBC) for 3D Manifold Microchannel Cooler Fabrication and Integration

16 views
Download

Download

IEEE.tv is made possible by the Members of IEEE.

This feature is accessible to IEEE Members only, with an IEEE Account. If you are an IEEE Member please sign in to enable this feature.

In addition to exclusive access to IEEE.tv programming, IEEE members have file download, and can save favorite videos with myTV.

Discover all the benefits of IEEE membership!

Belong to the world's largest technical proffecional society

  • Share
IEEE Electronics Packaging Society
Create Account or Sign In to post comments
#reliability #photonics #electronics #advanced packaging #heterogeneous integration

(20:35 + Q&A) - Yujui Lin, Stanford University

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

(20:35 + Q&A) - Yujui Lin, Stanford University

For videos/slides from other talks at the Symposium on Reliability of Electronics and Photonics Packaging (REPP'22), please visit our website and join our IEEE Dlist:  attend.ieee.org/repp

Advertisment

Next Up

00:52:15
Advanced Manufacturing for Semiconductor Packaging and Electronics Cooling
>
01:08:02
Thermal Challenges and Advanced Cooling Opportunities for 2.5D and 3D High Performance Computing
>
01:02:40
Using Diamond in Advanced Packaging: Current Developments and Status
>
01:02:40
Using Diamond in Advanced Packaging: Current Developments and Status
>
01:13:22
Origins of Silicon Valley: Roots in Ham Radio
>
01:13:22
Origins of Silicon Valley: Roots in Ham Radio
>

Advertisment