The RFIC 2018 Showcase highlights selected papers submitted by authors from industry and students from academia.
Authors of these papers present their innovative work, summarized in poster format, and some will also include a demonstration.
Please see http://rfic-ieee.org/ for more details. The RFIC 2018 Showcase is sponsored by the RFIC Steering Committee and through the generous support of our corporate sponsors.
Shimi Shilo and Dror Regev, from Toga Networks / Huawei Tel-Aviv Research Center, explain how they increase throughput by aggregating multiple available channels, as well as the challenge with parallel receivers and more.
Samsung’s Chia-Hsin Wu introduces his paper focusing on short-range wireless connectivity in mobile devices. Wu delves into the integration requirements for the 28nm CMOS Wireless Connectivity Combo IC with a reconfigurable 2x2 MIMO WiFi supporting 80+80MHz 256-QAM and BT 5.0 [RTU2B-1].
Infineon Technologies’ Vadim Issakov explains the main challenge of VCO, and their goal of a VCO with large FTR and low PN and how to overcome technical limitations. Issakov shares how the proposed Dual-Core 60GHz Push-Push VCO with second harmonic extraction by mode separation will achieve the desired frequency tuning range.
Infineon Technologies’ Jens Reinstaedt explains why their highly-functional VCO is useful to detecting materials from a distance. Reinstaedt demonstrates the chips detection capabilities, acting in addition to gesture sensing, vitals detection, and blind spot detection in a vehicle.
Global Foundries’ Steffen Lehmann shares a brief background about the site in Dresden, Germany where the Fully-Depleted SOI technology is developed. Lehmann then gives an overview of the 22FDX device development and its technical specifications.
CTO of Sivers IMA, Mats Carlsson, introduces and reviews the transceiver system and beamforming chip currently in development. Carlsson shares the technical aspects and functions of the chip in tandem with patch antennas to steer beams, create a fixed wireless link and more.
Georgia Tech’s Sensen Li introduces the motivation for his presentation, which is geared towards serving the 5G demand of relying on Massive MIMO. Li explains a 28GHz Packaged Chireix Transmitter with direct on-antenna outphasing load modulation achieving 56%/38% at peak/6dB back-off output power.
Columbia University’s Matt Bajor reviews the design goals for working within the angle, frequency and time domain in an RF-cluttered environment. Bajor explains an 8-Element, 1-3GHz Direct Space-to-Information Converter for rapid, compressive-sampling direction-of-arrival finding utilizing pseudo-random antenna-weigh modulation.
Northrop Grumman’s Tim Larocca introduces the Aerospace Systems department products developed for the defense market, such as those used by the U.S. Military. Larocca reviews his project, Q-Band CMOS transmitter system-on-chip for protected satellite communication.
Intel Lab’s Renzhi Liu introduces his recent work within the area of asymmetric wireless activity. Liu details the proposed architecture performed by a 264-µW IEEE 802.15.4a-Complaint IR-UWV Transmitter in 22nm FinFet for wireless network application.
Aravind Nagulu from Columbia University explains why wireless systems that simultaneously transmit and receive are gaining popularity over conventional interfaces. Nagulu goes into technical detail of the Fully-Integrated Non-Magnetic 180nm SOI Circulator with >1W P1dB and high isolation across 1.85VSWR specifications.
Woorim Shin from Intel Labs presents the specifications for Intel’s 22nm FinFET CMOS Technology within their target in E-band communication and explains its potential in next-generation communications. Shin explains the current technology and then factors the Compact 75 GHz LNA with 20-dB Gain and 4-dB Noise Figure into the measurement results.
Research Scientist Stephen Callender from Intel Labs explains the goal of their project in increasing the attainable bandwidth and efficiencies of bandwidth millimeter wave PAs that are implemented in deeply-scaled CMOS. Callender presents the architecture and design required to allow the Compact 75GHz PA with 26.3% PAE and 24GHz Bandwidth in 22nm FinFET CMOS to perform the network optimization.
Texas Instruments’ Sreekiran Samala introduces the CMOS mmWave Radar SoC Architecture and Applications project, presenting the framework and technical aspects that allows for high resolution and flexible multi-mode operation. Samala explains how this technology addresses all classes of short, medium and long-range radars.