Cart
Create Account
Sign In
(7:47) The IEEE Hybrid Bonding Symposium, now in its second year, is sponsored and run by the Santa Clara Valley (Silicon Valley) chapter of the IEEE Electronics Packaging Society. More information below.
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing depends critically on the process technology as well as materials and equipment. Design, performance characterization, thermal management and reliability are also important considerations to enable applications in various areas.
To access the full HBS program, and videos/slides for most of the presentations, visit https://attend.ieee.org/hbs/?page_id=779
To hear about future HBS events, subscribe to our IEEE ListServ Dlist: http://listserv.ieee.org/cgi-bin/wa?SUBED1=ieee-hbs&A=1
(7:47) The IEEE Hybrid Bonding Symposium, now in its second year, is sponsored and run by the Santa Clara Valley (Silicon Valley) chapter of the IEEE Electronics Packaging Society. More information below.
Hybrid Bonding has emerged as the technology of choice in the semiconductor and heterogeneous integration industries for ultra-fine-pitch interconnection. With significant benefits for interconnect density and device performance, it will become widely adopted for a broad range of high-performance semiconductor devices in the years to come. The success of Hybrid Bonding technology for high-volume manufacturing ...
