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Effect of Cu Microstructures on the Thermal Expansion of SiO2 Structures for 3D IC Heterogeneous Integration
Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 22-23, 2026 in Silicon Valley. More information below.
(23;10 + Q&A) Prof. Chih Chen, Materials Science and Engineering, National Yang Ming Chiao Tung University
Summary: This presentation investigates the effect of Cu microstructures on the thermal expansion in SiO2 vias for 3D IC heterogeneous integration. Four Cu microstructures are discussed, including large-grained Cu, (111)-oriented nanotwinned Cu, fine-grained Cu, and nanocrystalline Cu. The Cu microstructures affect the amount of expansion of Cu pads, as well as the grain growth behavior during the bonding process. Therefore, it is critical to select proper Cu microstructures for different applications.
Bio: Professor Chih Chen obtained his Ph.D. in Materials Science in 1999 from the research group of Professor King-Ning Tu at the University of California, Los Angeles (UCLA). In 2000, he joined the faculty of National Yang Ming Chiao Tung University (NYCU) and served as the Chair of the Department of Materials Science and Engineering from February 2017 to January 2023. Professor Chen discovered the direct current electroplating technique for (111)-oriented nanotwinned copper, which was published in Science in 2012. In 2016, he transferred this technology to Chemleader Inc. for large-scale production. As a result, he received several prestigious awards, including the National Innovation Award (2016), the Materials Innovation Award from the Taiwan Materials Research Society (2016), the Outstanding Technology Transfer Award (2017), the Taiwan Outstanding Researcher Award from the National Science and Technology Council (2017 and 2022), and the TMS 2018 Research to Industrial Practice Award from The Minerals, Metals & Materials Society (TMS). In 2022, he was recognized as a Fellow of the Taiwan Materials Research Society (MRS-T). Professor Chen’s current research interests include low-temperature Cu-to-Cu direct bonding, high-strength nanotwinned copper wires and films for 3D IC integration, and the reliability of flip-chip solder joints and microbumps in microelectronic packaging, with a focus on electromigration, thermomigration, and metallurgical reactions. He has published over 230 journal papers and holds more than 35 patents in Taiwan and the United States. Additionally, he co-authored a book on Science and Technology of Electronic Packaging with Professors King-Ning Tu and Hung-Ming Chen, which was published by Wiley in 2021.
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Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 22-23, 2026 in Silicon Valley. More information below.
(23;10 + Q&A) Prof. Chih Chen, Materials Science and Engineering, National Yang Ming Chiao Tung University
Summary: This presentation investigates the effect of Cu microstructures on the thermal expansion in SiO2 vias for 3D IC heterogeneous integration. Four Cu microstructures are discussed, including large-grained Cu, (111)-oriented nanotwinned Cu, fine-grained Cu, and nanocrystalline Cu. The Cu microstructures affect the amount of expansion ...
