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(44:42) Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.
With Laura Mirkarimi, Adeia; Alexeev Anton, EVG; Christopher Netzband, TEL; Joeri De Vos, imec; and Robert Patti, NHanced Semiconductor
Chaired by Dongkai Shangguan, Thermal Engineering Associates
Summary: A very exciting set of exchanges that explore the immediate future of hybrid bonding, and the many anticipated applications. This expansion and adoption of hybrid bonding is driven by its major advantages in signal integrity and power reduction -- results that are needed for advanced packaging to meet the needs of data centers and artificial intelligence servers.
To access the full HBS program, and videos/slides for most of the presentations, visit https://attend.ieee.org/hbs/?page_id=779
To hear about future HBS events, subscribe to our IEEE ListServ Dlist: http://listserv.ieee.org/cgi-bin/wa?SUBED1=ieee-hbs&A=1
(44:42) Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.
With Laura Mirkarimi, Adeia; Alexeev Anton, EVG; Christopher Netzband, TEL; Joeri De Vos, imec; and Robert Patti, NHanced Semiconductor
Chaired by Dongkai Shangguan, Thermal Engineering Associates
Summary: A very exciting set of exchanges that explore the immediate future of hybrid bonding, and the many anticipated applications. This expansion and adoption of hybrid bonding is driven by its major advantages in signal integrity and power reduction ...
