Investigation of Materials and Processes for Polymer-Based Hybrid Bonding

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#Hybrid bonding #advanced packaging #metrology #2.5D #3D #die stacking #Cu-Cu

(20:39 + Q&A) Dr. Yu Shoji, Toray Industries, Inc.
From the First IEEE Hybrid Bonding Symposium 
Summary: This study explores the development and application of low-temperature curable polyimides for 3D stacking in organic hybrid bonding technology. The research demonstrates that these polyimides exhibit significant polishing rates when using alkaline slurry, and successful bonding was achieved for both polyimide-to-polyimide and polyimide/copper hybrid bonds at low annealing temperatures. The bonding mechanisms were investigated from both chemical and physical perspectives. Additionally, the study confirmed that polymer hybrid bonding with copper protrusion test vehicles, polished using Chemical Mechanical Polishing (CMP), resulted in robust polyimide-to-polyimide and copper-to-copper joints. The insulation reliability of these bonds was maintained even after accelerated testing.
Bio: Yu Shoji received his Ph.D. in the Department of Organic and Polymeric Materials from Tokyo Institute of Technology in 2013. In the same year, he joined Toray Industries, Inc., where he was engaged in the development of photosensitive heat-resistant resins until 2023. In 2024, he was assigned to Toray Singapore Research Center, where he is involved in providing technical support for materials to customers and exploring new research projects. His research is based on polymer chemistry and physics focusing on functional organic polymeric materials synthesized by polycondensation. Utilizing functional polymers from polycondensation that exhibit heat resistance, chemical resistance and high mechanical strength; his core research investigates the possibilities of implementing polymers for electronic materials. His current research focuses on developing inter-layer insulating materials for next-generation of semiconductor packages.

For other edited  videos from this symposium, visit  https://attend.ieee.org/hbs/?page_id=456

(20:39 + Q&A) Dr. Yu Shoji, Toray Industries, Inc.
From the First IEEE Hybrid Bonding Symposium 
Summary: This study explores the development and application of low-temperature curable polyimides for 3D stacking in organic hybrid bonding technology. The research demonstrates that these polyimides exhibit significant polishing rates when using alkaline slurry, and successful bonding was achieved for both polyimide-to-polyimide and polyimide/copper hybrid bonds at low annealing temperatures....

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