Metrology Solutions for Hybrid Bond Processes: How to Push the Limits?

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#Hybrid bonding #advanced packaging #metrology #2.5D #3D #die stacking #Cu-Cu

(27:34 + Q&A) Peter Hoffrogge, PVA TePla Analytical Systems
From the First IEEE Hybrid Bonding Symposium 
Summary: Hybrid bond processes are enabling an technology for heterogeneous 3D integration of devices. The feature size of electrical contacts is rapidly shrinking and with them shrinks the non-critical size for voids and delamination in the bond interface. Scanning acoustic microscopy is the state of the art for inline metrology on hybrid bonded wafers. Together with the process technology for hybrid bonding, the inspection of the wafers needs to equally improved. Actual leading edge processes already require detection capabilities below 10µm, in the next years this may decrease even below 5µm. Furthermore c2w processes should avoid water on the chip side of the wafer, because the water can enter small gaps or delaminations on the edge of the chips. To archive these requirements acoustic microscopes need to optimized for this application. The water as a needed coupling media is only applied locally on the carrier side of the wafer, the chips side remains dry all throughout the inspection process. The resolution limit for acoustic microscopes is typically know to be in the range of 10µm to 20µm, higher operating frequency, a significant improvement of the SNR and avoiding any kind of signal attenuation of the acoustic beam allow to push the resolution and capability to the 5µm limit. For the inspection of thinned chips UHF tonebursts are used to move the capability down to 1µm. Artefacts such as Moire pattern can occur in acoustic images – with the correct selection of the scanning parameters they can be completely avoided.
Bio: Peter Hoffrogge is product manager and a Member of the board at PVA TePla Analytical Systems. He Studied Physics at the University Münster in the group of Prof Hillenkamp and holds over 50 patent applications for FA and inline metrology solutions and more than 80 publications. He has 30+ years experience in Microscopy and metrology solutions (SEM, FIB, SAM, X-ray, Nearfield microscopy) and 25 years experience in research and development for metrology equipment. He is active in several public and funded research projects (SAM³, FA4.0, FA2IR, ID2PPAC).

For other edited  videos from this symposium, visit  https://attend.ieee.org/hbs/?page_id=456

(27:34 + Q&A) Peter Hoffrogge, PVA TePla Analytical Systems
From the First IEEE Hybrid Bonding Symposium 
Summary: Hybrid bond processes are enabling an technology for heterogeneous 3D integration of devices. The feature size of electrical contacts is rapidly shrinking and with them shrinks the non-critical size for voids and delamination in the bond interface. Scanning acoustic microscopy is the state of the art for inline metrology on hybrid bonded wafers. Together with the process technology for hybrid bonding ...

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