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(26:17 + Q&A) Dr. John H Lau, Unimicron Technology Corporation
Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.
Summary: Cu-Cu hybrid bonding is an old technology and has been in very high-volume manufacturing (HVM) for more than 10 years. In this lecture, the origin and fundamentals of Cu-Cu hybrid bonding will be very briefly mentioned. The HVM products such as those by (1) Sony’s CIS with WoW, (2) Sony’s CIS with WoWoW, (3) Samsung’s CIS, (4) AMD’s 3D V-Cache, (5) Graphcore’s IPU, (6) Apple’s M5 (GPU and CPU), (7) AMD’s MI300A (3.5D), (8) Samsung’s 3.5D, (9) Broadcom’s 3.5D, (10) Samsung’s HBM, (11) SK Hynix’s HBM, (12) Micron’s HBM, (13) YMTC’s 3D NAND Flash, and (14) Western Digital’s 3D NAND Flash will be briefly mentioned. Some recommendations will be provided.
Bio: John Lau with more than 40 years of R&D and manufacturing experience in semiconductor packaging, has published more than 530 peer-reviewed papers (385 as the principal investigator), 52 issued and pending US patents (31 as the principal inventor), and 25 textbooks. He has been actively participating in industry/academy/society meetings/conferences to contribute, learn, and share.
To access the full HBS program, and videos/slides for most of the presentations, visit https://attend.ieee.org/hbs/?page_id=779
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(26:17 + Q&A) Dr. John H Lau, Unimicron Technology Corporation
Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.
Summary: Cu-Cu hybrid bonding is an old technology and has been in very high-volume manufacturing (HVM) for more than 10 years. In this lecture, the origin and fundamentals of Cu-Cu hybrid bonding will be very briefly mentioned. The HVM products such as those by (1) Sony’s CIS with WoW, (2) Sony’s CIS with WoWoW, (3) Samsung’s CIS ...
