Redefining the Limits: Die to Wafer Hybrid Bonding

(21:58 + Q&A) Jonathan Abdilla, Director of Technical Marketing, Besi
From the First IEEE Hybrid Bonding Symposium 
Summary: As Moore’s Law slows, the semiconductor industry is turning to advanced packaging techniques to sustain technological progress. A key emerging concept is chiplets, which facilitate heterogeneous integration by combining multiple smaller chips into a single package. While chiplets have been around for some time, the industry’s adoption of the Universal Chiplet Interconnect Express (UCIE) standard promises to accelerate their development and deployment by enabling interoperability between chiplets from different suppliers. Die-to-wafer (D2W) hybrid bonding is a promising technology that addresses the increasing demand for higher interconnect density and smaller die sizes. By directly bonding dies onto a wafer, D2W hybrid bonding can enable significant performance improvements and reduced power consumption. However, this technology presents new challenges, such as precise placement and understanding the complex interactions between materials and processes. This presentation provides an overview of hybrid bonding process flows and findings from actual D2W bonds performed with a high-accuracy hybrid bonder. We will also highlight Key performance factors of a D2W hybrid bonder and typical features of a D2W hybrid bonder.
Bio: Jonathan Abdilla is Director of Technical Marketing at Besi. He holds a Degree in Mechanical Engineering and an MBA. Prior to his current position, he has worked in many roles, from Production Engineer to R&D Process Specialist, R&D Manager, as well as Product Manager. He has authored several articles, papers and book chapters, and has over 18 years of semiconductor packaging experience. He also serves on several advanced packaging technical committee boards.

For other edited  videos from this symposium, visit  https://attend.ieee.org/hbs/?page_id=456