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Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 22-23, 2026 in Silicon Valley. More information below.
(28:35 + Q&A) Robert Patti, President/CEO, NHanced Semiconductors, Inc.
Summary: Foundry 2.0 brings together the best of all technologies and material solutions by using the interconnect and manufacturing methods typically used in building semiconductor devices themselves. This foundry evolution, based on Advanced Packaging (AP), is inherently a different business than today’s foundry model. Key to the success of Foundry 2.0 is hybrid bonding. This provides seamless connection of semiconductor devices, dies, and chiplets. It accommodates components built with diverse optimized materials and technologies and sourced from different manufacturers. As hybrid bonding continues to make strides in improved yields and reduced bonding pitches, so it also moves to fulfill the continuing promises of Moore’s Law. This talk will discuss the AP tool box and how new advances in deep sub-micron hybrid bonding are enabling the next generation of microelectronics.
Bio: Bob Patti is the president of NHanced Semiconductors, Inc. He has spearheaded the development and delivery of cutting-edge 3D and 2.5D integration technology for high energy physics, medicine, automotive, military, HPC, and other fields. He has managed hardware engineering teams in several organizations, including successful startups. Bob received the 2009 SEMI Award for North America for his pioneering work in 3D IC integration and the 2015 3DIncites Individual Achievement Award.
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Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 22-23, 2026 in Silicon Valley. More information below.
(28:35 + Q&A) Robert Patti, President/CEO, NHanced Semiconductors, Inc.
Summary: Foundry 2.0 brings together the best of all technologies and material solutions by using the interconnect and manufacturing methods typically used in building semiconductor devices themselves. This foundry evolution, based on Advanced Packaging (AP), is inherently a different business than today’s foundry model ...
