Temporary Bonding Materials for the Enablement of Hybrid Bonding

(22:34 + Q&A) Dr. Andrea Chacko, Director of Packaging Solutions, Brewer Science R&D
From the First IEEE Hybrid Bonding Symposium
Summary: The implementation of advanced packaging technologies relies on advanced materials to address the challenges preventing the continued shrink and performance improvement of devices. Hybrid bonding is critical for achieving high quality, fine pitch interconnects. Dies and wafers that will be utilized for hybrid bonding will need to be prepared through a series of processing steps including wafer thinning and backside processing. These processing steps are enabled by temporary bonding and debonding materials. In this talk, temporary bonding and debonding materials to achieve direct die-to-wafer and collective die-to-wafer hybrid bonding will be discussed. We will highlight material requirements for hybrid bonding and demonstrate how smart material design can improve process flows.
Bio: Andrea Chacko earned a PhD in Chemistry from the University of Massachusetts Amherst. She currently serves as Director of Packaging Solutions within Brewer Science’s Corporate R&D team. She leads several projects including the development of materials for wafer thinning and for other advanced semiconductor packaging applications. She began her career at Brewer Science in 2013 as an Industrial Postdoc and has also worked on high-temperature-stable materials and underlayers for extreme ultraviolet (EUV) lithography.