Wafer Bonding Challenges and the Resolution of Paths

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#Hybrid bonding #advanced packaging #metrology #2.5D #3D #die stacking #Cu-Cu

(21:47 + Q&A) Dr. Ilseok (Sunny) Son, TEL Technology Center America
From the First IEEE Hybrid Bonding Symposium
Summary: Hybrid wafer bonding is one of key modules in 3DI/HI (3D Integration & Heterogeneous Integration) proving a next generation scaling resolution path through 3D Xtacking in NAND flash, multilayer stacking in HBM (High bandwidth memory) and sequential integration flows in advanced logic FEOL device architectures. In this talk, definition, process flow, and challenges in hybrid bonding will be introduced. In addition, TEL’s research work on the challenges will be discussed. This discussion will cover a wide range of topics including incoming wafer condition’s impact on bonding void & alignment, plasma surface activation modeling & yield impact, bonding alignment impact on e-test with 0.5um pitch hybrid bonding, Cu recess/ oxidation characterization & resolution, Cu anneal expansion modeling, improved bonding energy measurement method, and wafer distortion modeling.
Bio: Ilseok Son (Sunny) is currently the 3D Interconnect and Heterogeneous Integration Manager and member of technical staff at TEL technology Center America (TTCA) one of the largest R&D centers for TEL outside of Japan. One of his key focus is on scaling copper hybrid bonding technologies. Sunny received Ph.D. in electrical engineering at UW-Madison working on MEMS and started his career at Intel, covering Lithography process and equipment, Mask Inspection, Wafer Bonding (temporary & permanent) process & equipment development, and Layer transfer integration at Intel Component Research. During his Intel career Sunny was recognized by receiving the Intel Achievement Award for a novel interconnect architecture and technology for advanced nodes. Later, he moved to South Korea to join SK Hynix as R&D center metrology manager to provide metrology solutions for memory development. He later built a new team for wafer bonding and worked as a manager and a tech leader to apply hybrid bonding in memory architectures until he joined TTCA. Sunny’s work on hybrid bonding has been presented at several conferences including ECTC, IMAPS, SEMI 3DI, IITC and IEDM.
 

(21:47 + Q&A) Dr. Ilseok (Sonny) Son, TEL Technology Center America
From the First IEEE Hybrid Bonding Symposium
Summary: Hybrid wafer bonding is one of key modules in 3DI/HI (3D Integration & Heterogeneous Integration) proving a next generation scaling resolution path through 3D Xtacking in NAND flash, multilayer stacking in HBM (High bandwidth memory) and sequential integration flows in advanced logic FEOL device architectures. In this talk, definition, process flow, and challenges in hybrid bonding will be introduced....

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