Cart
Create Account
Sign In
Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.
(24:19 + Q&A) Julius Hållstedt, Head of Semi and Electronics, Excillum
Summary: The transition from 2D scaling to heterogeneous integration and hybrid bonding demands inspection techniques capable of resolving ever-smaller features buried deep within complex 3D architectures. Optical methods lack both the resolution and the ability to probe inside packaged devices. Electron microscopy offers superior resolution but is limited to surface analysis, requires destructive sample preparation, and cannot provide volumetric insight. X-ray imaging overcomes these limitations: its penetrating power enables non-destructive probing, while techniques such as computed tomography (CT) and laminography open the door to true 3D reconstruction.
Until recently, conventional X-ray methods were constrained by resolution, measurement speed, and throughput, leaving intricate hybrid bond structures seemingly out of reach. Breakthroughs in nano-focus X-ray sources now push resolution to levels once considered unattainable—making 3D visualization of hybrid bonds and fine-pitch interconnects a practical reality. We demonstrate this capability using X-ray nano-computed tomography (nano-CT). Most strikingly, we present results from an AMD Ryzen 7 5800X3D processor featuring hybrid copper bonding with 1.5 µm vias at 9 µm pitch. Individual bond pads are clearly resolved in 3D, and the resolution is sufficient to begin investigating metallization and layer structures within the bonding region. These case studies show that X-ray nano-CT and laminography have moved beyond traditional boundaries. By extending resolution beyond what the industry believed possible, they are emerging as indispensable tools for failure analysis, yield acceleration, and process optimization in hybrid bonding.
Bio: Julius Hållstedt has worked with the development, implementation, and market introduction of advanced X-ray solutions since 2009. He is currently Head of the Semiconductor/Electronics Segment at Excillum. He is a frequent speaker at international conferences and has authored or co-authored more than fifty scientific papers. He received his M. Sc. degree in materials science and his Ph.D. degree in solid-state electronics from the Royal Institute of Technology (KTH), Stockholm, Sweden, in 2002 and 2007 respectively.
To access the full HBS program, and videos/slides for most of the presentations, visit https://attend.ieee.org/hbs/?page_id=779
To hear about future HBS events, subscribe to our IEEE ListServ Dlist: http://listserv.ieee.org/cgi-bin/wa?SUBED1=ieee-hbs&A=1
Presented at the 2026 IEEE Hybrid Bonding Symposium, Jan 21-22, 2026 in Silicon Valley. More information below.
(24:19 + Q&A) Julius Hållstedt, Head of Semi and Electronics, Excillum
Summary: The transition from 2D scaling to heterogeneous integration and hybrid bonding demands inspection techniques capable of resolving ever-smaller features buried deep within complex 3D architectures. Optical methods lack both the resolution and the ability to probe inside packaged devices. Electron microscopy offers superior resolution ...
