The Future is Heterogeneous Integration: The HI Roadmap 2021 Edition

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#heterogeneous integration #HI #HI Roadmap #pre-competitive #supply chain #broad innovation #HI chapters #future vision

(21.52) - Fifth Annual Symposium On Heterogeneous Integration - transformation, HI Roadmap, pre-competitive, supply chain, broad innovation, HI chapters, future vision, next steps ...  William (Bill) Chen holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining ASE, he was Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. Bill is a past President of the IEEE Electronics Packaging Society. . He is a Life Fellow of IEEE and a Fellow of ASME. He received the ASME InterPACK Achievement Award in 2007. In 2018, he received the IEEE Electronics Packaging Field Award, recognizing his contribution to electronic packaging, from research & development through industrialization.
Bill chairs the Heterogeneous Integration Roadmap initiative, co-sponsored by 3 IEEE Societies (EPS, EDS & Photonics) together with SEMI & ASME Electronics & Photonics Packaging Division.

To access all the videos and slides from the 5th Heterogeneous Integration Symposium, held in Silicon Valley in February 2022, please visit https://r6.ieee.org/scv-eps/?p=2865

(21.52) - Fifth Annual Symposium On Heterogeneous Integration - transformation, HI Roadmap, pre-competitive, supply chain, broad innovation, HI chapters, future vision, next steps ...  William (Bill) Chen holds the position of ASE Fellow & Senior Technical Advisor at ASE Group. Prior to joining ASE, he was Director at the Institute of Materials Research & Engineering (IMRE) in Singapore, following a distinguished career at IBM Corporation. Bill is a past President of the IEEE Electronics Packaging Society....

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