NIST RFI Roundtable – CHIPS Act Advanced Packaging Manufacturing Program

(1:48:57) -- co-located with 5th Heterogeneous Integration Symposium - The session focuses on planning for the advanced packaging manufacturing program of the CHIPS Act through a recently announced US Dept. of Commerce RFI -- This Roundtable is a great introduction for understanding the US$52 billion that will be invested by the U.S. government to enhance domestic capabilities in semiconductor and advanced packaging manufacturing. You will see the particular questions that NIST is asking potential universities and companies that are interested in participating, to have their capabilities funded in the areas of workforce training (including university undergraduate and graduate education), pilot line development/expansion, and on-shore production.

Your will hear the inputs by a number of experts that will shape the future of advanced packaging manufacturing in the United States.  In this virtual roundtable session, we invite your responses to questions related to planning a Department of Commerce (NIST)-supported advanced packaging manufacturing program: incentivizing investment in semiconductor manufacturing facilities and associated ecosystems; providing shared infrastructure to accelerate semiconductor R&D and prototyping; supporting research related to advanced packaging;  supporting advanced metrology research; and enhancing workforce preparation.

To access all the videos and slides from the 5th Heterogeneous Integration Symposium, held in Silicon Valley in February 2022, please visit https://r6.ieee.org/scv-eps/?p=2865