Panel: SiP and Module for Automotive Applications for Heterogeneous Integration

69 views
Download
  • Share
#heterogeneous integration #HI #automotive electronics

(1:03:36) - Moderators: Erik Jung, Fraunhofer IZM, and Veer Dhandapani, NXP.  Panelists: Andreas Grassmann, Infineon Technologies; Shishuang Sun, Tesla; Burt Carpenter, NXP Semiconductor; Prezemyslaw Gromala, Bosch; and David Rae, Qualcomm Technology.

To access all the videos and slides from the 5th Heterogeneous Integration Symposium, held in Silicon Valley in February 2022, please visit https://r6.ieee.org/scv-eps/?p=2865

(1:03:36) - Moderators: Erik Jung, Fraunhofer IZM, and Veer Dhandapani, NXP.  Panelists: Andreas Grassmann, Infineon Technologies; Shishuang Sun, Tesla; Burt Carpenter, NXP Semiconductor; Prezemyslaw Gromala, Bosch; and David Rae, Qualcomm Technology.

Speakers in this video

Advertisment

Advertisment