Panel: SiP and Module for Automotive Applications for Heterogeneous Integration

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IEEE Electronics Packaging Society

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#heterogeneous integration #HI #automotive electronics

(1:03:36) - Moderators: Erik Jung, Fraunhofer IZM, and Veer Dhandapani, NXP. Panelists: Andreas Grassmann, Infineon Technologies; Shishuang Sun, Tesla; Burt Carpenter, NXP Semiconductor; Prezemyslaw Gromala, Bosch; and David Rae, Qualcomm Technology.

To access all the videos and slides from the 5th Heterogeneous Integration Symposium, held in Silicon Valley in February 2022, please visit https://r6.ieee.org/scv-eps/?p=2865

(1:03:36) - Moderators: Erik Jung, Fraunhofer IZM, and Veer Dhandapani, NXP. Panelists: Andreas Grassmann, Infineon Technologies; Shishuang Sun, Tesla; Burt Carpenter, NXP Semiconductor; Prezemyslaw Gromala, Bosch; and David Rae, Qualcomm Technology.

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February 25, 2022

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