Join us for a high-interest panel discussion from APEC 2016. The next genereation power supply must have higher power density, advanced pakaging, be more efficient and emit low heat. A panel of experts from all aspects of the power supply world discuss these issues and more.

Between evolving topologies, advanced materials, and improved core technologies, the way we manage and distribute power is under multiple pressures to change and evolve as well. This is especially dramatic in the area of power supplies themselves, the heart of every electronic system. These core enablers also change the devices they power, in areas such as form factor, thermal management, operational lifetime and the increased focus on higher power densities. From wide-bandgap semiconductors to advanced power supply topologies to the latest magnetics, the panelists from Vicor, Eaton, and GAN Systems have a deep understanding of these pressures. The panel explores some of the ways to address these issues and help predict the future of the power supply.

Session Speakers:

• Zhuo Min “Joe” Liu (Eaton)
• Alex Paultre (Power Systems Design Magazine - moderator)
• Larry Spaziani (GaN Systems)
• Paul Yeaman (Vicor)