IMS 2014:Flip Chip Assembly for Sub-millimeter Wave Amplifier MMIC on Polyimide Substrate

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In this paper, we report the feasibility of flip chip assembly in sub-millimeter wave band. A suitable GND pattern for chip mounting board is discussed based on simulation and measurement. The measurement results of the flip chip mounting MMIC amplifier are presented as well.

In this paper, we report the feasibility of flip chip assembly in sub-millimeter wave band.

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