IMS 2012 Microapps - Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminates

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#2012 #IMS #MicroApps #Reducing Active Device Temperature Rise #RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminate #Allen F. Horn

IMS 2012 MicroApps presents " Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity Low Loss Circuit Laminate," by Allen F. Horn, III of Rogers.

July 6, 2012