Cart
Create Account
Sign In
Already purchased this program?
Login to View
This video program is a part of the Premium package:
EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics
- IEEE MemberUS $29.95
- Society MemberUS $0.00
- IEEE Student MemberUS $29.95
- Non-IEEE MemberUS $39.95
EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics
In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.
In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.
