EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics

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EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics


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EMC - Li Er-Ping - Signal integrity and EMI in high speed electronics

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In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.
In this presentation, we will discuss the fundamental design principles and challenges to achieve the low noise power distribution network, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design.