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EMC - Joungho Kim - Signal integrity of TSV-based 3D IC
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EMC - Joungho Kim - Signal integrity of TSV-based 3D IC
In this presentation, we will discuss signal integrity design methodologies and approaches to solve signal integrity design issues. Finally, we will propose future TSV and interposer architectures for the TB/s scale data-bandwidth.
In this presentation, we will discuss signal integrity design methodologies and approaches to solve signal integrity design issues. Finally, we will propose future TSV and interposer architectures for the TB/s scale data-bandwidth.
