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EMC - Joungho Kim - Signal integrity of TSV-based 3D IC
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EMC - Joungho Kim - Signal integrity of TSV-based 3D IC
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In this presentation, we will discuss signal integrity design methodologies and approaches to solve signal integrity design issues. Finally, we will propose future TSV and interposer architectures for the TB/s scale data-bandwidth.
In this presentation, we will discuss signal integrity design methodologies and approaches to solve signal integrity design issues. Finally, we will propose future TSV and interposer architectures for the TB/s scale data-bandwidth.
