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Pt. 2: Electronic & Photonic (Co)Packaging Technologies - Bill Bottoms - Industry Panel 2, IEEE Globecom, 2019
Bill Bottoms, Third Millennium Test Solutions, focuses on the new integration of architectures as the key to moving forward into the future of electronics and photonics. Bottoms considers the limitations of co-packaging, the benefits of integrated circuits, 5G factors, and how best to meet the demands of the data growth explosion.
Read more about this event at https://globecom2019.ieee-globecom.org/program/industry-program/industry-panels#IP-02-03
Bill Bottoms, Third Millennium Test Solutions, focuses on the new integration of architectures as the key to moving forward into the future of electronics and photonics. Bottoms considers the limitations of co-packaging, the benefits of integrated circuits, 5G factors, and how best to meet the demands of the data growth explosion.
