Shear Performance and Accelerated Reliability of 6×6 mm FOWLP Solder Joints using an ENIG PCB Electrode

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(11:06 + Q&A) Prof. Tan Cher Ming, Chang Gung University. Presented at the 2021 REPP Symposium.

In this study, we designed a PCB and FOWLP test vehicle with a ENIG surface finish. After optimizing from 21 bonding parameters (temperature, holding time and shear strength), the best bonding parameter was achieved. We conducted accelerated pressure cooker test and measured the solder joint morphology, shear strength and failure modes.

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(11:06 + Q&A) Prof. Tan Cher Ming, Chang Gung University. Presented at the 2021 REPP Symposium.

In this study, we designed a PCB and FOWLP test vehicle with a ENIG surface finish. After optimizing from 21 bonding parameters (temperature, holding time and shear strength), the best bonding parameter ....

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