Using AI to Address Thermal Challenges in Data Center SoCs

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#Reliability #Failure Modes #Testing #Electronics #Photonics #SiPho #AI #Thermal

(25:14) Dr. Amr Haggag, Head of Silicon Quality, ARM 
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: (not available)
Dr. Amr Haggag is ARM Head of Silicon Quality. Prior he led the quality and reliability team for Google custom silicon (Tensor), technology/design reliability for Apple silicon (A-, M- and S- series) and was quality technical director at Motorola / Freescale. He has > 20 yrs semiconductor industry quality leadership experience and has served on the International Technology Roadmap for Semiconductors (ITRS) reliability committee as well as the management and technical committee of the IEEE premier conference on semiconductor reliability, IRPS. He has over 40 publications with several invited talks and tutorials in semiconductor quality and reliability including an IRPS best paper on machine learning methods to reduce field failures the data center. He received his PhD degree in 2002, his MS degree in 1999 and his BS degree in 1996 all in Electrical and Computer Engineering from the University of Illinois at Urbana Champaign.

For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp

(25:14) Dr. Amr Haggag, Head of Silicon Quality, ARM 
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: (not available)
Dr. Amr Haggag is ARM Head of Silicon Quality. Prior he led the quality and reliability team for Google custom silicon (Tensor), technology/design reliability for Apple silicon (A-, M- and S- series) and was quality technical director at Motorola / Freescale. He has > 20 yrs semiconductor industry quality leadership experience...

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