Apex-Hybrid: An Advanced X-ray Imaging System with Dual-Mode Imaging Modality

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#REPP #electronics packaging #photonics packaging #metrology

(18:08 + Q&A) Dr. Wenbing Yun, Sigray, Inc. — Failure analysis (FA) of advanced semiconductor packages is becoming increasingly challenging due to shrinking feature sizes in advanced packaging and 3D stacking. Existing techniques struggle to balance high spatial resolution with the need to analyze large planar samples, such as advanced packages, chiplets, PCBs, and wafers. This paper introduces a novel imaging tool that integrates high-resolution micro-computed tomography (microCT) with advanced laminography, achieving a spatial resolution of 300 nm. By combining innovative laminography with a traditional CT architecture, the system overcomes the geometric distortions and resolution limitations of conventional laminography. This versatile tool enables high-resolution package inspection to rapid board-level FA, streamlining workflows in modern semiconductor FA labs without requiring multiple X-ray systems. Case studies illustrate its efficiency and precision in real-world applications.
Bio: Dr. Wenbing Yun is a leading researcher in X-ray imaging, an innovator, a serial entrepreneur, and OSA fellow. He has over sixty issued patents on x-ray technology. Formerly a beamline scientist, he founded Xradia, Inc., a company aimed at enabling synchrotron-like x-ray microscopy in the laboratory. Under his leadership, the company established itself as a worldwide leader in high performance X-ray microscopes, growing profitably with over 100 people employed in the San Francisco Bay Area, and was successfully acquired by Carl ZEISS as its X-ray Microscope Division. Dr. Yun subsequently started Sigray, Inc. with a mission to make accessible all synchrotron analytical techniques to laboratories worldwide and to advance the performance of existing laboratory x-ray technologies by at least an order of magnitude. Sigray’s growing product portfolio includes microXRF, XAS, and nano x-ray microscope systems, and its key advantages lie in its patented x-ray source and optics components and its patented system designs. The company is now known as the x-ray equipment market leader with the highest performing products across all categories of x-ray techniques. 

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(18:08 + Q&A) Wenbing Yun, Sigray, Inc. — Failure analysis (FA) of advanced semiconductor packages is becoming increasingly challenging due to shrinking feature sizes in advanced packaging and 3D stacking. Existing techniques struggle to balance high spatial resolution with the need to analyze large planar samples, such as advanced packages, chiplets… (more)

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