Avoiding Inelastic Strains in Solder Joint Interconnections of IC Packages

12 views
Download
  • Share
#strain #stress #interconnect reliability #theory of reliability

(21.44) Dr. Ephraim Suhir, Portland State University (IEEE Fellow; IEEE-EPS Distinguished Lecturer)

Merits, attributes and challenges associated with the application of analytical predictive modeling in electronics and photonics packaging reliability engineering are addressed. The emphasis on some practically important, yet paradoxical, i.e., intuitively non-obvious, materials and structural behaviors. It is concluded that three basic approaches in microelectronics and photonics materials science and engineering – analytical (“mathematical”) modeling, numerical modeling (simulation) and experimental investigations – are equally important in understanding the physics of the materials behavior and in designing viable and reliable electronic devices and products.

For additional videos of presentations at REPP'21, please visit attend.ieee.org/repp, and sign up for our IEEE Dlist to hear about future events.

(21.44) Dr. Ephraim Suhir, Portland State University (IEEE Fellow; IEEE-EPS Distinguished Lecturer)

Speakers in this video

Advertisment

Advertisment