Co-Design Methodology for Reliable 3D-Integrated DWDM Silicon Photonics

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#advanced packaging #photonics packaging #SiPh #SiPho #24-channel receiver #photonics co-design #16 Gbps #power integrity

(24:20 + Q&A) Dr. Jinsung Youn, Hewlett-Packard Enterprise. 

For other presentations at the Symposium on Reliability of Electronics and Photonics Packaging, please visit our website:  attend.ieee.org/repp, and join our IEEE Dlist.

(24:20 + Q&A) Dr. Jinsung Youn, Hewlett-Packard Enterprise. 

For other presentations at the Symposium on Reliability of Electronics and Photonics Packaging, please visit our website:  attend.ieee.org/repp, and join our IEEE Dlist.

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