(14:35 + Q&A) Lakshmi Kari, Celestial AI — This talk explores how strategic RAS integration is shaping the future of co-packaged optics, enabling scalable, resilient, and serviceable interconnect solutions for next-generation AI infrastructure. We’ll examine key industry challenges, design trade-offs, and best practices that bridge engineering excellence with operational efficiency. Attendees will gain insights into how RAS principles can be leveraged not only to reduce downtime and improve maintainability, but also to drive long-term value, customer trust, and competitive advantage in the evolving optical interconnects landscape.
Bio: Lakshmi Kari serves as Director of Quality and Reliability at Celestial AI, for silicon photonics hardware platforms. She brings two decades of semiconductor experience spanning device physics, failure analysis, and system-level reliability. Lakshmi’s work focuses on developing scalable quality systems and advancing data-driven reliability methodologies for emerging hardware technologies.
Edited videos and slides from most of the REPP talks are available at https://attend.ieee.org/repp/?page_id=2110
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Organized by the IEEE Silicon Valley chapter of the Electronics Packaging Society: https://ieee.org/scveps
(14:35 + Q&A) Lakshmi Kari, Celestial AI — This talk explores how strategic RAS integration is shaping the future of co-packaged optics, enabling scalable, resilient, and serviceable interconnect solutions for next-generation AI infrastructure. We’ll examine key industry challenges, design trade-offs, and best practices… (more)
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