Development of Standardized and Scalable Glass-based Technology for the Next-generation Electronic-Photonic Systems in a Package

(26:22 + Q&A) Dr. Sylwester Latkowski, Eindhoven University of Technology — Development of Standardized and Scalable Glass-based Technology for the Next-generation Electronic-Photonic Systems in a Package — Intimately integrated, electronic-photonic systems are a path forward for the next-generation products, in particular those supporting the backbone of the AI data-center infrastructure. A combination of electronic and photonic functionalities in a compact form factor is necessary to cope with demanding performance expectations, energy efficiency, and stringent cost constraints. All these resulted in an increased interest and intensified development efforts in the domain of heterogeneous integration technologies on various substrate materials, supporting robust, reliable, and scalable integration of electronics and photonics. A panel-level, heterogeneous integration technology on a glass substrate has been developed by a consortium around the PhotonicLEAP activity. It features a ball grid array (BGA) approach, a widely recognized surface mount technology (SMT) standard used in semiconductor manufacturing technologies, for high-density electrical input-output (IO) ports. Multi-channel optical interfaces use a relaxed tolerance coupling design, allowing for the high-count, low-loss signal transmission, in out-of-plane, or in-plane configuration between the package and free space or pluggable connectors. Electrical IOs and redistribution layer (RDL) support DC and RF, fan out, and interconnects beyond 67GHz. Along with the assembly, new methods and solutions for the test and validation of such packages have been established. Simultaneous, top-bottom, electronic-photonic probing, automated handling, high-speed inspection methods, and modular automated test equipment, suitable for a singulated package characterization, and scalable to test and inspection to panel-level. The form factor of the package and the BGA layout are compliant with JEDEC standards, allowing for the reuse of existing solutions and faster adoption by industry. The design aspects regarding the test and assembly processes were captured in the form process design kit (PDK). 
Bio: Sylwester Latkowski obtained M.Sc. and Eng. degrees in optoelectronics and technical physics from the West Pomeranian University of Technology in Szczecin, Poland, and a PhD in photonics at the Centre for High-Speed Devices and Systems at Dublin City University, Ireland. His early research concerned mode-locked semiconductor lasers, millimeter and terahertz photonics, and all-optical signal processing for data transmission in optical networks. Sylwester followed up his interests with the Photonic Integration group at Eindhoven University of Technology (TU/e), the Netherlands, focusing on test assembly and packaging of integrated photonics, photonic integration technologies, and on-chip laser systems for sensing applications. Sylwester’s professional activities include an active role in road-mapping initiatives for integrated photonics and microelectronics (IPSR-I and HIR). He is a chair and co-chair of the electronic-photonic test Technical Working Group of the Integrated Photonic Systems Roadmap International, supported by AIM Photonics Academy and Photon Delta ecosystems. He has authored and co-authored more than 135 publications in international scientific journals and conference proceedings.

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