Experiences of Electronics Packaging at Scania: Challenges and Opportunities

(14:22 + Q&A) Alexander Hillström, Scania & Malardalen University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: As the automotive industry embraces electrification, automation, and digitalization, the reliability of electronic components has become increasingly critical. With the growing complexity of the system architecture and higher demand for computing power, the use of high-density packaging will increase in our electronic control units (ECU). Solder joint reliability in these systems is a key area of concern from the effects of thermal and vibration stresses that will occur in heavy duty trucks. At Scania, Accelerated Life Testing (ALT) has traditionally been used to ensure robustness and reliability of our components, but any changes in manufacturing after initial acceptance will not be picked up until a large number of field quality issues occur. This presentation addresses the reliability challenges associated with electronics packaging at Scania. We will examine a case study, including an ECU where we have experienced issues with the solder joints of Ball Grid Arrays (BGA), and explore how advanced data analytics, and real-time monitoring could be used to detect anomalies.

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