Insights into the Reliability of Advanced Glass Packages

(36:04 + Q&A) Prof. Vanessa Smet, Georgia Tech
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: This talk explores the emergence of glass as a prime candidate for high-performance substrates in chiplet-based systems. Its unique mechanical properties allow for larger body sizes than traditional organic and silicon substrates; however, concerns about core cracking and other reliability issues remain. We will demystify the reliability of advanced glass packages by summarizing key failure mechanisms and modes, such as thermal stress fractures and interface delamination. Additionally, the discussion will provide perspectives on innovative solutions to enhance the reliability of glass substrates, paving the way for their broader adoption in next-generation semiconductor packaging.
Bio: Vanessa Smet received the B.S. and M.S. degrees in applied physics from the École normale supérieure Paris-Saclay, Cachan, France, and the University of Paris XI, Orsay, France, and the Ph.D. degree in electronics from the University of Montpellier 2, Montpellier, France, in 2010, focusing on power cycling reliability of IGBT power modules in harsh environment.,She was a Post-Doctoral Researcher with the Tyndall National Institute, Cork, Ireland, where she was involved in novel high-temperature high-power die-attach solutions for power switches with Ag-CNTs composites and microBGA assembly. She is currently an Associate Research Professor and the Program Manager for the Interconnections and Assembly Industry Program with the 3-D Systems Packaging Research Center (PRC), Georgia Institute of Technology. At PRC, she provides leadership to develop and demonstrate new interconnection and assembly technologies beyond solders for advanced 2.5-D and 3-D packaging, as well as high-power applications, with a focus on manufacturability and technology transfer to industry. She has coauthored over 30 journal and conference publications and two patents with others pending. Her current research interests include power electronics, finite element modeling, 3-D integration, interconnection and assembly processes, SLID / TLP bonding, all-Cu interconnections, low-temperature bonding, and reliability.

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