Advanced Package Technologies and their Reliability Challenges

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#heterogeneous integration #advanced packaging #EMIB #Foveros #reliability #yield

(28:07) Dr. Jason Zhang, Intel Corp.  Review: "This is an good overview of Intel's new heterogeneous integration packaging for their processor families, covering EMIB, Foveros, FoverosOmni, and FoverosDirect; materials, thermal management, advanced substrates, electrical/power performance, and yield."

Intel invented two disruptive technologies — the Embedded Multi-die Interconnect Bridge (EMIB) family and the Foveros family — which enabled higher I/Os/mm, higher signal integrity and low cost. This presentation details the two technologies, their challenges and solutions.

For additional presentations from the Symposium on Reliability of Electronics and Photonics Packaging, please visit attend.ieee.org/repp; join our IEEE Dlist to receive more information.

(28:07) Dr. Jason Zhang, Intel Corp.  Review: "This is an good overview of Intel's new heterogeneous integration packaging for their processor families, covering EMIB, Foveros, FoverosOmni, and FoverosDirect; materials, thermal management, advanced substrates, electrical/power performance, and yield."

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