Overview of Advanced System Integration and Packaging (ASIP) at Purdue University

(7:17) Prof. Ganesh Subbarayan, Purdue University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Bio: Ganesh Subbarayan is the James G. Dwyer Professor of Mechanical Engineering at Purdue University and the Co-Director of the Purdue-Binghamton SRC Center for Heterogeneous Integration Research in Packaging (CHIRP). He also serves as the Director of the recently created Atalla Institute for Advanced System Integration and Packaging (ASIP) at Purdue University. He began his professional career at IBM Corporation (1990-1993). He holds a B.Tech degree in Mechanical Engineering (1985) from the Indian Institute of Technology, Madras and a Direct Ph. D. (1991) in Mechanical Engineering from Cornell University. Dr. Subbarayan’s research is broadly concerned with modeling and experimentally characterizing failure in microelectronic devices and assemblies. He was a pioneer in using geometric models directly for analysis, popularly referred to as Isogeometric Analysis. Among others, Dr. Subbarayan received the 2024 Richard Chu Award for Excellence in Thermal and Thermo-Mechanical Management of Electronics, 2022 SRC Technical Excellence Award, 2005 Excellence in Mechanics Award from the ASME Electronics and Photonics Packaging Division and the NSF CAREER award. He is a Fellow of ASME as well as IEEE, and he served as the Editor-in-Chief of IEEE Transactions on Advanced Packaging during 2002-2010.

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