Photonics Technology and Heterogeneous Integration: Challenges

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#REPP #electronics packaging #photonics packaging

(18:47 + Q&A) David McCann, Amkor, and IEEE Electronics Packaging Society Technical VP.
Welcome, from the IEEE Electronics Packaging Society; Silicon Photonics is needed to overcome speed and power limitations for AI and High Performance Computing products. The technology needed to solve these barriers is available but are the solutions cost effective and commercially viable to scale? Challenges for the industry will be presented….
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Organized by the IEEE Silicon Valley chapter of the Electronics Packaging Society: https://ieee.org/scveps 

(18:47 + Q&A) David McCann, Amkor, and IEEE Electronics Packaging Society Technical VP.
Welcome, from the IEEE Electronics Packaging Society; Silicon Photonics is needed to overcome speed and power limitations for AI and High Performance Computing products. The technology needed to solve these barriers is available but are the solutions cost effective and commercially viable to scale? Challenges for the industry will be presented….

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