Reliability Investigation for Scaling 3D Interconnects in Advanced Semiconductor Packaging

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#Reliability #Failure Modes #Testing #Electronics #Photonics #SiPho

(14:38 + Q&A) Shuhang Lyu, Purdue University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging

For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp

(14:38 + Q&A) Shuhang Lyu, Purdue University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging

For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp

Speakers in this video

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