Reliability Investigation for Scaling 3D Interconnects in Advanced Semiconductor Packaging
(14:38 + Q&A) Shuhang Lyu, Purdue University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp
(14:38 + Q&A) Shuhang Lyu, Purdue University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp