(21:16) Prof. Srikanth Rangarajan, Binghamton University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: In today’s data-driven world, the demand for high-performance computing and cloud services continues to rise, placing unprecedented pressure on data center operations. Central to sustaining this growth and enabling high performance computing is the need for reliable and efficient cooling systems. As we advance in cooling technologies to manage the skyrocketing heat dissipation requirement, there’s a growing focus on creating new tools and methods for ensuring the reliability of components and systems, aiming to achieve data center uptime comparable to that of current air-cooled facilities. This talk addresses the critical reliability aspects of electronic cooling in data centers, exploring the intricate balance between thermal management and system longevity.
This talk will explore reliability modeling of data center rack-level systems and subsystems, providing insights into the critical elements that drive operational resilience. We will discuss methodologies for constructing reliability models that accurately reflect the complex interactions and dependencies among components within rack-level architectures. By examining failure modes, assessing component interplay, and employing statistical and simulation-based techniques, we can derive actionable insights to enhance system robustness. This presentation reflects the outcomes of the research conducted under the ARPA-E COOLERCHIPS program. Ultimately, this talk aims to provide insights into integrating reliability into the cooling infrastructure, ensuring that data centers not only meet current operational demands but are also poised for future advancements in technology.
Bio: Srikanth Rangarajan currently serves as an Assistant Professor in the school of System Science and Industrial Engineering at Binghamton University. He received his M.S & Ph.D. in Mechanical Engineering from the Indian Institute of Technology Madras 2017. His research interests include Energy Storage management systems, electronic packaging, Digital twinning for electronics and batteries, Thermal energy storage, Thermal Management of electronics, and Data center cooling. Srikanth is also the author of the book “Phase Change Material Heat Sinks: A multi-objective Perspective.” Prior to joining the School of System Science and Industrial Engineering, Srikanth worked as an Associate Research Professor in the Department of Mechanical Engineering at SUNY Binghamton.
For additional talks from this REPP, or earlier ones, please visit https://attend.ieee.org/repp
(21:16) Prof. Srikanth Rangarajan, Binghamton University
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: In today’s data-driven world, the demand for high-performance computing and cloud services continues to rise, placing unprecedented pressure on data center operations. Central to sustaining this growth and enabling high performance computing is the need for reliable and efficient cooling systems...