Reliability of Bonded Interface Materials for Power Electronics

(25:44 + Q&A) Sreekant Narumanchi, Ph.D., Center for Integrated Mobility Sciences, National Renewable Energy Laboratory
From the 2024 IEEE Symposium on Reliability for Electronics and Photonics Packaging
Summary: High-performance and reliable thermal and bonded interface materials are significant enablers towards the vision of compact, high-performance, reliable, and low-cost high-temperature power electronics packaging for electric-drive vehicles, as well as several other renewable energy and energy efficiency applications. In this presentation, I will present an overview of our efforts over the past 15 years on the experimental and modeling aspects of the thermomechanical reliability of bonded interfaces for power electronics packaging.
Dr. Sreekant Narumanchi is a Distinguished Member of Research Staff and Manager of the Advanced Power Electronics and Electric Machines group within the Center of Integrated Mobility Sciences at the National Renewable Energy Laboratory, where he has completed almost 20 years. He leads a Group of 15 researchers focused on packaging, thermal management and reliability of power electronics and electric machines for electric-drive vehicles and multiple other applications. His group has collaborated with over 80 institutions across industry, universities, national and research labs, and federal agencies. Sreekant is an American Society of Mechanical Engineers (ASME) Fellow, and recipient of the 2023 ASME Avram Bar-Cohen Memorial Medal and the 2022 THERMI Award. He has over 120 peer-reviewed publications and 5 patents. Sreekant had/has multiple leadership roles in conferences, journals, committees, and advisory boards. He received a Ph.D. from Carnegie Mellon University (2003), M.S. from Washington State University (1999), and B. Tech. from Indian Institute of Technology Kanpur (1997), all in Mechanical Engineering.

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